Title

Deposition of nickel on electrodeposited Cu2O films at potentials more positive than the Nernst potential of Ni2+/Ni0

Document Type

Article

Publication Date

1-1-2017

Abstract

Depositionofnickelonelectrodeposited Cu O films was investigated at potentials more positive than the estimated Nernst equilibrium potential of Ni /Ni for the purpose of developing a monolayer deposition method that will act as a protective and catalytic overlayer on the oxide films. Cu O films were subjected to 0.08 mM nickel acetate solutions for 60 s at potentials more positive than the estimated Nernst equilibrium potential of Ni /Ni . The quantities of Ni recovered from the Cu O films were determined by atomic absorption spectrometry. The oxidation state of Ni deposited on the Cu O was determined to be +3 via X-ray photoelectron spectroscopy. The absence of evidence of reduction of Ni to Ni suggests that the nature of the nickel deposition is adsorption, and it is not characterized as underpotential deposition. Photoelectrochemical measurements showed that deposited Ni protected Cu O films from the photodecomposition to Cu by interfering with H binding to the O surface sites, and indicated the possibility of catalytic activity of deposited nickel for H reduction. The catalytic activity of deposited nickel was explained by the shift of the Cu O Fermi level by 50 mV in negative direction upon nickel deposition. 2 2 2 2 2 2- 2 2+ 0 2+ 0 2+ 0 0 + +

Publication Name

Journal of the Electrochemical Society

Volume Number

164

First Page

H615

Last Page

H620

Issue Number

9

DOI

10.1149/2.0751709jes

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